Solder profiles

  • We deliver three profiles with the eC-reflow-pilot software: a lead free profile, a lead profile, and an IMS profile. The lead free profile is also preloaded in the eC-reflow-mate.
  • To be able to solder using a chamber oven like the eC-reflow-mate it is important to understand that:
    • The dwell temperature of the solder alloy needs to be reached at all solder joints present on the board. Therefore the max temperature in the curve should be set at solder temperature of the alloy + a delta T on the board. This delta T depends on the size of the board, the copper load of the board, the component load and size on the board etc… For a standard board this delta T will be around 25°C. therefore our standard lead free curve is set at 245°C as highest temperature
    • The only real parameter you can control in the solder process is the Time. A PCB needs time to heat up. This time required depends on size of the board, on copper load, solder mask colour, component load and size, etc… some experience will be required to estimate this for your board. Our lead free program includes 5 curves with different timings. It is advisable, when in doubt to start with a longer program. You can always speed it up next time.

Oven Parameters

  • Oven parameters are linked to the profile (curve) because they too are influenced by the product (PCB) you are soldering:
    • Pre heater:
      • Generally we define the pre heater (bottom IR-lamps) to follow the furnace (top IR-lamps) curve on a distance of 40°C. this means that the pre heater parameter is set to -40°C … see screen shot. This way the pre heater supports the furnace curve in the best possible way. If more power is needed the -40°C can be reduced to -30°C or less.
      • For double sided soldering we suggest that the pre heater is set to a maximum temperature of 175°C for lead free soldering and 150°C for lead soldering. This to keep the temperature on the bottom side as low as possible and yet high enough to support the solder process on the top side.
    • Temperature correction:
      • For your PCB, a difference in temperature registration will exist between the furnace and the external sensor measured at the maximum temperature in the curve. For use of the eC-reflow-mate without the external sensor for soldering this type of PCB, you can compensate this temperature difference by setting the difference value at a temperature (max). For example -25°C at 245°C measured.
    • Reflow hold time:
      • During the running of a solder profile you can force the oven to reach the maximum temperature set in the curve and remain there for X seconds as defined in the reflow hold time parameter.

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